IDH08G120C5XKSA1

Infineon Technologies · CoolSiC™+ Series

Infineon CoolSiC+ IDH08G120C5XKSA1, SiC Schottky diode, 1200 V DC reverse, 8 A average rectified, zero reverse recovery time, -55°C to 175°C junction, PG-TO220-2-1 package.

Infineon Technologies IDH08G120C5XKSA1
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Technical specifications

IDH08G120C5XKSA1 specifications
Parameter / AttributeSpecification / Value
SeriesCoolSiC™+
MountingThrough Hole
Voltage - DC reverse (Vr)1200 V
Voltage - forward (Vf) (Max) @ if1.95 V @ 8 A
Current - reverse leakage @ vr40 µA @ 1200 V
Current - average rectified8A
Operating temperature - junction-55°C ~ 175°C
SpeedNo Recovery Time > 500mA (Io)
PackageTube
TechnologySiC (Silicon Carbide) Schottky
CaseTO-220-2
Capacitance @ vr,365pF @ 1V, 1MHz
Reverse recovery time0 ns

Technical details

1200 V SiC Schottky — zero-recovery switching

The Infineon IDH08G120C5XKSA1 is a CoolSiC+ silicon-carbide Schottky diode rated for 1200 V DC reverse and 8 A average rectified current, in a through-hole TO-220-2 package.

What zero trr buys the power stage

In a hard-switched PFC or DC-DC converter, a silicon fast-recovery diode's reverse recovery current adds a loss term that scales with switching frequency and temperature. The IDH08G120C5XKSA1 eliminates that term entirely — the recovery is purely capacitive, so switching losses are limited to the device's output capacitance (365 pF at 1 V). The 1.95 V forward drop at 8 A and 25°C is higher than a comparable silicon hyperfast diode, but the total loss at high frequency is lower because the switching component is near zero. The 40 µA leakage at 1200 V is typical for a 1200 V SiC Schottky and rises with junction temperature — the 175°C maximum junction rating gives the thermal budget to run the die hot without derating the blocking voltage.

Package and mounting — TO-220-2 through-hole

The PG-TO220-2-1 package is a standard two-lead TO-220 with the tab as the cathode. The through-hole mounting suits point-to-point wiring, heatsink attachment with a screw or clip, and hand-assembly rework. The junction-to-case thermal resistance is set by the die attach and the copper tab area — a greased interface to a heatsink is the normal mounting method for continuous 8 A operation at high ambient.

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