IDH04G65C6XKSA1

Infineon Technologies

Infineon IDH04G65C6XKSA1 SiC (Silicon Carbide) Schottky diode, 650 V reverse voltage, 12 A average rectified current, zero reverse recovery time, TO-220-2 through-hole package, -55°C to 175°C junction temperature.

Infineon Technologies IDH04G65C6XKSA1
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Technical specifications

IDH04G65C6XKSA1 specifications
Parameter / AttributeSpecification / Value
MountingThrough Hole
Voltage - DC reverse (Vr)650 V
Voltage - forward (Vf) (Max) @ if1.35 V @ 4 A
Current - reverse leakage @ vr14 µA @ 420 V
Current - average rectified12A
Operating temperature - junction-55°C ~ 175°C
SpeedNo Recovery Time > 500mA (Io)
PackageTube
TechnologySiC (Silicon Carbide) Schottky
CaseTO-220-2
Capacitance @ vr,205pF @ 1V, 1MHz
Reverse recovery time0 ns

Technical details

650 V SiC Schottky — zero-recovery switching for PFC and flyback stages

Its zero reverse recovery time (0 ns trr) eliminates the switching losses that plague silicon ultrafast diodes in hard-switched topologies — a direct efficiency gain for power-factor-correction (PFC) boost stages, flyback converters, and solar inverter freewheeling paths.

With trr = 0 ns, the IDH04G65C6XKSA1 generates no reverse-recovery charge. In a 100 kHz PFC boost, this eliminates the turn-on loss spike in the MOSFET and reduces the EMI signature from the diode snap-off. The 14 µA reverse leakage at 420 V (25 °C) is typical for a 650 V SiC Schottky of this die size; leakage doubles with temperature, so the thermal design should budget for the hot-case leakage at the 175 °C limit. The 205 pF junction capacitance at 1 V bias is the dominant contributor to the diode's capacitive turn-on loss at high frequency. For a 200 kHz LLC converter, the Coss-related loss is roughly 0.5 W — a figure that should be included in the heatsink calculation alongside the forward conduction loss.

Active production, ROHS3, and sourcing posture

It is ROHS3 compliant. The TO-220-2 through-hole package (PG-TO220-2) is a standard footprint for board-level power stages.

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