What this flyback controller is and where it fits
The Infineon ICE5ASAGXUMA1 is an offline flyback switching controller with an integrated power switch, rated for 60 W output in a non-isolated topology. It operates at a fixed 100 kHz switching frequency with a 75% maximum duty cycle, and includes a full protection suite covering current limiting, open loop, overload, over-temperature, and over-voltage faults. The part is packaged in an 8-SOIC (PG-DSO-8) footprint for surface-mount assembly, and is rated for junction temperatures from -40°C to 150°C. Typical applications include auxiliary power supplies, AC-DC adapters, and industrial bias rails where a compact, protected flyback stage is needed.
60 W power rating and 100 kHz switching — what they mean for the BOM
The 60 W output capability sets the transformer and bulk capacitor sizing — expect a core in the EFD20/25 range and a 400 V bulk cap around 33–47 µF for universal AC input. The 100 kHz switching frequency is a sweet spot for transformer size versus switching losses; it keeps the flyback transformer compact while staying below the point where snubber losses dominate. The 75% duty cycle ceiling gives headroom for low-line operation (85 VAC) without hitting the max on-time limit. The internal power switch simplifies the layout — no external MOSFET selection or gate-drive loop to tune. The 10 V to 25.5 V Vcc range covers the output of a standard auxiliary winding, and the 16 V start-up threshold ensures clean power-on sequencing.
Protection features and control interface
The ICE5ASAGXUMA1 integrates EN (enable), Soft Start, and Sync control pins, allowing external on/off control, programmable soft-start ramp, and synchronization to an external clock if needed. The fault protection covers current limiting, open-loop detection, overload, over-temperature, and over-voltage — reducing the need for external supervisory circuitry in the BOM.
Lifecycle and sourcing posture
The ICE5ASAGXUMA1 carries an Active lifecycle status per the Infineon product record and is ROHS3 compliant. There is no LTB notice or successor part on file.
Package and rework considerations
The 8-SOIC (0.154" body width, 3.90 mm) package is a standard surface-mount footprint with a 1.27 mm pitch. No exposed thermal pad — junction temperature is managed through the leadframe and PCB copper. For rework, standard SOIC hot-air profiles at 260°C peak (10 s max) are safe;.