FM25V02A-DGTR

Infineon Technologies

Infineon Technologies F-RAM™ series, 256Kbit FRAM, SPI interface, 40 MHz clock, 32K x 8 organization, 2V-3.6V supply, -40°C to +85°C, 8-WDFN exposed pad, Tape & Reel.

Infineon Technologies FM25V02A-DGTR
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MOQ 1 · Tape & Reel (TR) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

FM25V02A-DGTR specifications
Parameter / AttributeSpecification / Value
SeriesF-RAM™
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2V ~ 3.6V
Clock frequency40 MHz
Memory interfaceSPI
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR)
TechnologyFRAM (Ferroelectric RAM)
Memory size256Kbit
Memory formatFRAM
Case8-WDFN Exposed Pad
Memory organization32K x 8

Technical details

Active lifecycle — no design-in hesitation

The FM25V02A-DGTR: That means you can drop it into a new BOM today without planning a respin for a replacement part next year.

256Kbit FRAM — why the SPI speed and endurance matter

This is a 256Kbit ferroelectric RAM organized as 32K x 8, accessed over an SPI bus at up to 40 MHz. Unlike EEPROM or NOR flash, FRAM writes at bus speed with no write-cycle delay — the 40 MHz clock is the actual throughput ceiling, not a page-buffer bottleneck. The non-volatile nature means data survives power loss without a battery or supercap. For a data logger writing every 100 ms, the 10^14 cycle endurance (typical for this FRAM family) outlives the product by decades — no wear-leveling needed.

Runs on a single 2V to 3.6V rail, so it sits comfortably on a 3.3V bus and can also drop into a 1.8V core-voltage domain without a separate regulator.

8-DFN package — layout and thermal note

Housed in an 8-WDFN with exposed pad, 4x4.5 mm body. The DFN footprint is compact enough for space-constrained designs but demands a solder-paste stencil aperture that covers at least 50% of the pad area to avoid voids.

FM25V02A-DGTR
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