CYUSB3013-BZXC

Infineon Technologies · EZ-USB FX3™ Series

Infineon Technologies EZ-USB FX3™ series, ARM9 USB 3.0 peripheral controller, 512K x 8 RAM, 60 I/O, GPIF / I²C / I²S / SPI / UART / USB interfaces, 121-TFBGA, Tray.

Infineon Technologies CYUSB3013-BZXC
Download datasheet (PDF)
[IN STOCK] In Stock: 7 pcs
$49.05/ pc

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MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

CYUSB3013-BZXC specifications
Parameter / AttributeSpecification / Value
SeriesEZ-USB FX3™
MountingSurface Mount
Controller seriesCYUSB
Program memory typeExternal Program Memory
Supply voltage1.15V ~ 1.25V
InterfaceGPIF, I²C, I²S, SPI, UART, USB
Operating temperature0°C ~ 70°C
PackageTray
RAM size512K x 8
ApplicationsSuperSpeed USB Peripheral Controller
Number of i (O)60
Core processorARM9®
Case121-TFBGA

Technical details

ARM9 core with 512K x 8 RAM for USB 3.0 throughput

The CYUSB3013-BZXC is an ARM9-based SuperSpeed USB peripheral controller from the EZ-USB FX3 series. It integrates 512K x 8 of on-chip RAM and a flexible GPIF interface alongside I²C, I²S, SPI, UART, and USB connectivity, making it a single-chip bridge between a USB 3.0 host and a wide range of parallel or serial peripherals. The 60 general-purpose I/O lines, combined with the GPIF state machine, allow the controller to connect directly to image sensors, FPGA configuration ports, or application processors without an external CPLD or glue logic.

Housed in a 121-ball TFBGA (10x10 mm body), the CYUSB3013-BZXC is a surface-mount device intended for reflow assembly. The 0.50 mm ball pitch demands a controlled-impedance PCB stack-up and a clean breakout strategy for the high-speed USB 3.0 differential pairs. For designs that see extended ambient temperatures, the industrial-grade sibling in the same package is the alternative to evaluate.

Active production with RoHS3 compliance

It is fully RoHS3 compliant, with no exemption declarations needed for the BOM. As an active part, it is sourced through authorized distribution channels.

CYUSB3013-BZXC
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