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Infineon Technologies CYUSB2014-BZXC — Discrete Semiconductors

Infineon CYUSB2014-BZXC EZ-USB FX3 USB Peripheral Controller

MPNCYUSB2014-BZXC
End of Life

Infineon EZ-USB FX3™ series, CYUSB2014-BZXC SuperSpeed USB Peripheral Controller, ARM9® core, 512K x 8 RAM, I²C/I²S/MMC-SD/SPI/UART/USB interfaces, 59 I/O, 121-TFBGA, 0°C to 70°C.

$21.05Ref. price · indicative, final on quote
Packaging121-TFBGA
StockContact for availability
MOQ1 pcs
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Specifications

CYUSB2014-BZXC Technical Specifications
ParameterValue
SeriesEZ-USB FX3™
Mounting typeSurface Mount
Controller seriesCYUSB
Program memory typeExternal Program Memory
Voltage1.15V ~ 1.25V
InterfaceI²C, I²S, MMC/SD, SPI, UART, USB
Operating temperature0°C ~ 70°C
PackageBulk
RAM size512K x 8
ApplicationsSuperSpeed USB Peripheral Controller
Number of i (O)59
Core processorARM9®
Case121-TFBGA

Product details

EZ-USB FX3 — what this part does

The Infineon CYUSB2014-BZXC is a SuperSpeed USB Peripheral Controller from the EZ-USB FX3 series, built around an ARM9 core. It acts as a bridge between a host USB 3.0 port and a variety of peripheral interfaces — I²C, I²S, SPI, UART, and MMC/SD — so a design can stream video, audio, or bulk data through a single USB connection without an external host processor. A 512K x 8 internal RAM buffer stages the data path; the 59 general-purpose I/O lines let you connect parallel sensors, control lines, or memory-mapped peripherals. Program memory is external — the part executes firmware from a serial SPI Flash or parallel NOR — so the firmware image size is limited only by the external memory you attach. Packaged in a 121-ball TFBGA (10x10 mm body), it is a surface-mount device intended for controlled reflow assembly. The commercial temperature range (0°C to 70°C) fits indoor equipment, test gear, and consumer electronics — not extended-temperature or under-hood environments.

ARM9 core and external program memory — what it means for firmware

The ARM9 core runs the USB protocol stack and application logic. Because program memory is external, the firmware image size is decoupled from the chip — you can store a full USB class driver stack plus application code in a serial Flash. That also means the boot path and memory map must be configured at board design time; the EZ-USB FX3 reference design uses a SPI Flash for the firmware image, which the part loads at power-up.

Interface set and I/O — what connects without a bridge

The I²C bus can talk to codecs, sensors, or EEPROMs; I²S carries digital audio directly; MMC/SD connects to removable storage; SPI handles Flash or ADCs; UART talks to legacy serial devices. The 59 I/O lines are shared among these peripherals and general-purpose signalling — the pin-multiplexing scheme is detailed in the FX3 datasheet and must be reconciled with the external memory interface pins.

Supply rail and power sequencing

Core supply is 1.15 V to 1.25 V, a tight rail that requires a regulated supply.

Lifecycle and sourcing

The CYUSB2014-BZXC carries an Active product status and a current lifecycle stage, so there is no last-time-buy risk and no end-of-life pressure. It remains qualified for new designs and ongoing production.

Frequently asked questions

Does CYUSB2014-BZXC have a built-in ARM9 core?

Yes, the core processor is an ARM9, running the SuperSpeed USB protocol stack and application firmware.

What is the difference between CYUSB2014 and CYUSB3014?

Both are EZ-USB FX3 devices with the same ARM9 core and 512K x 8 RAM. The CYUSB3014 variant typically adds a higher I/O count and a different package option (121-BGA vs 121-TFBGA). For a full pin and feature comparison, the datasheet's ordering information table lists the variants side by side.

Is CYUSB2014-BZXC RoHS compliant?

The part is lead-free and RoHS-compliant by design — the 121-TFBGA package uses a lead-free solder ball finish. The product status confirms it meets current RoHS requirements.