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Infineon Technologies CY8C4146FNI-S433T — Analog & Data Acquisition

Infineon CY8C4146FNI-S433T PSoC 4 MCU, 48MHz, 64KB Flash

MPNCY8C4146FNI-S433T
End of Life

Infineon Technologies PSoC® 4 CY8C4100S ARM Cortex-M0+ MCU, CY8C4146FNI-S433T, 48MHz, 64KB Flash, 8KB RAM, CapSense, 12-bit SAR ADC, 35-WLCSP, -40°C to 85°C.

$4.66Ref. price · indicative, final on quote
Packaging35-XFBGA, WLCSP
RoHSROHS3 Compliant
SeriesPSOC® 4 CY8C4100S
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY8C4146FNI-S433T specifications
ParameterValue
SeriesPSOC® 4 CY8C4100S
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 5.5V
Operating temperature-40°C ~ 85°C (TA)
Speed48MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size8K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SPI, UART/USART
Number of i (O)31
Core processorARM® Cortex®-M0+
Case35-XFBGA, WLCSP
Data convertersA/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Program memory size64KB (64K x 8)

Product details

48 MHz Cortex-M0+ with integrated analog — the CapSense and sensor hub MCU

The CY8C4146FNI-S433T is a PSoC 4 part built around a 32-bit ARM Cortex-M0+ core running at 48 MHz. What sets it apart from a generic M0+ MCU is the programmable analog and digital fabric on the same die — the on-chip CapSense block, 12-bit SAR ADC, and dual IDACs mean a capacitive touch interface or analog sensor front-end fits without external converters. 64 KB of flash and 8 KB of RAM are modest by application-processor standards, but they are sized for the single-chip control-and-UI role this part targets: a touch panel with a few sensor inputs, a simple LCD segment display, and a serial link back to a host controller.

WLCSP package — board space drives the package choice

The 35-ball WLCSP (2.11 x 2.6 mm) is the smallest package option in the PSoC 4 CY8C4100S series. At this pitch, the PCB layout must account for the 0.4 mm ball pitch typical of this package class — fan-out via micro-vias or a fine-line layer is expected. The 31 available I/O in this package count is enough for a CapSense matrix plus a serial bus and a few general-purpose signals, but the trade-off is that not every peripheral pin is brought out compared to a QFN variant.