On-chip CapSense and LCD drive — BOM consolidation
The CY8C4045PVI-DS402: This part integrates CapSense capacitive-sensing blocks and an LCD segment driver directly on the die. For a panel with a few touch buttons and a simple segment display, you skip the external touch controller and display driver IC — that saves board area and a couple of dollars in BOM cost.
On a battery-powered design, the lower end lets it keep running as the cells drain.
The 28-SSOP package is a surface-mount, 0.209"-wide body with a 5.30 mm width — a standard SOIC-like footprint that reflows cleanly and is inspectable without X-ray.
