Skip to main content
Infineon Technologies CY7C4142KV13-106FCXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C4142KV13-106FCXC QDR-IV SRAM, 144Mbit

MPNCY7C4142KV13-106FCXC
Active

Infineon Technologies CY7C4142KV13-106FCXC QDR-IV synchronous SRAM, 144Mbit, 1.066 GHz clock, 4M x 36 organization, 1.26-1.34V supply, 361-FCBGA, Tray.

$323.6500Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C4142KV13-106FCXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.26V ~ 1.34V
Frequency1.066 GHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR IV
Memory size144Mbit
Memory formatSRAM
Case361-BBGA, FCBGA
Memory organization4M x 36

Product details

QDR-IV SRAM at 1.066 GHz — what the clock rate means for the datapath

The CY7C4142KV13-106FCXC is a 144 Mbit QDR-IV synchronous SRAM from Infineon, organized as 4M x 36 and clocked at 1.066 GHz. That clock frequency is the I/O toggle rate on the address and data buses — the internal memory array runs at a quarter of that speed, but the QDR-IV architecture pipes four 36-bit words per clock cycle, giving a peak read bandwidth of roughly 38.4 Gbit/s per port. The 1.26 V to 1.34 V core supply is tight — a 1.3 V nominal rail with ±3 % regulation keeps the PLL and I/O buffers in spec. The commercial temperature range (0 °C to 70 °C) suits enterprise networking gear, test equipment, and high-end compute accelerators where the ambient is controlled, not automotive or outdoor enclosures.

361-FCBGA package — rework and board integration notes

Housed in a 361-ball fine-pitch BGA (FCBGA), 21 mm x 21 mm body. The 1.0 mm ball pitch is manageable with a standard rework station — pre-bake at 125 °C for 8 hours if the tray seal has been broken, per J-STD-033 MSL 3 handling. The surface-mount footprint demands a multi-layer PCB with controlled impedance traces for the 1.066 GHz signalling; the QDR-IV bus is source-synchronous, so trace-length matching on the data and strobe pairs is non-negotiable. Delivered in tray format — not tape-and-reel. For volume pick-and-place, the trays are JEDEC-compatible; for small-batch rework, the FCBGA's solder balls are collapsible with a standard hot-air profile peaking at 245 °C. No lead-free exemption listed; assume RoHS-compliant per Infineon's standard policy.

Frequently asked questions

Where can I buy CY7C4142KV13-106FCXC and how is it quoted?

Sourced to order against an RFQ through independent and authorized distribution channels. Submit an RFQ for your target quantity and target price.

What is the memory organization and interface of this QDR-IV SRAM?

Organized as 4M x 36 (144 Mbit total), with a parallel QDR-IV interface. The 36-bit word width suits wide-bus datapaths in networking switches, routers, and high-speed packet buffers where separate read and write ports reduce bus contention.