Skip to main content
Infineon Technologies CY7C4141KV13-667FCXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C4141KV13-667FCXC QDR IV SRAM, 144Mbit, 667 MHz

MPNCY7C4141KV13-667FCXC
Active

Infineon CY7C4141KV13-667FCXC QDR IV synchronous SRAM, 144Mbit (4M x 36), 667 MHz clock, parallel interface, 1.26V-1.34V supply, 361-FCBGA (21x21), tray.

$218.5000Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C4141KV13-667FCXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.26V ~ 1.34V
Frequency667 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR IV
Memory size144Mbit
Memory formatSRAM
Case361-BBGA, FCBGA
Memory organization4M x 36

Product details

144Mbit QDR IV at 667 MHz — what the clock buys you

The CY7C4141KV13-667FCXC: The 667 MHz clock on this QDR IV SRAM translates to a 1.33 Gbps data rate per pin on the read and write ports, because QDR IV transfers data on both clock edges. That bandwidth targets network switch buffers and high-end compute lookaside tables where the latency of DDR DRAM is a bottleneck. Organized as 4M x 36, the 144Mbit density fits packet buffers in 100 GbE line cards or L3 cache in FPGA-based accelerators — the 36-bit word width matches the internal bus width of many network processors without packing overhead.

Supply rails and temperature — the design constraints

The core supply is a tight 1.26 V to 1.34 V window — a 1.3 V ±3% rail. That means the VRM tolerance plus ripple must stay inside 40 mV peak-to-peak, which typically forces a separate LDO or a multi-phase switcher with remote sense, not a shared 1.2 V or 1.5 V plane. The 0°C to 70°C (TA) commercial temperature grade limits this part to controlled indoor environments — server rooms, central offices, lab equipment. No deployment in outdoor base stations or under-hood automotive without active cooling that keeps the ambient below 70°C.

361-FCBGA — reflow and board integration

The flip-chip construction puts the die face-down on the substrate, so the thermal interface is through the balls, not a top-side heatsink. Plan for tray-fed pick-and-place or manual placement for prototypes.

Active lifecycle — no LTB pressure

That means standard sourcing through authorized distribution is the baseline; no need to broker-surf for inventory. The base product number CY7C4141 covers the QDR IV family; speed and temperature variants share the same footprint. If the 667 MHz speed grade or commercial temp range is tight for your BOM, a -5 or -6 speed grade or industrial temp sibling may swap in without a board spin — confirm the specific order code against your timing and thermal budget.

Frequently asked questions

What is the memory organization of CY7C4141KV13-667FCXC?

It is organized as 4M words by 36 bits, for a total of 144 Mbit. The 36-bit word width matches the bus of many network processors and FPGAs without byte packing.