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Infineon Technologies CY7C4141KV13-633FCXI — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C4141KV13-633FCXI QDR IV SRAM, 144 Mbit, 633 MHz

MPNCY7C4141KV13-633FCXI
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Infineon / Cypress CY7C4141KV13-633FCXI, QDR IV synchronous SRAM, 144 Mbit (4M x 36), 633 MHz clock, parallel interface, 1.26 V – 1.34 V supply, -40°C to 85°C, 361-FCBGA (21x21 mm), tray.

$229.3408Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C4141KV13-633FCXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.26V ~ 1.34V
Frequency633 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR IV
Memory size144Mbit
Memory formatSRAM
Case361-BBGA, FCBGA
Memory organization4M x 36

Product details

144 Mbit QDR IV SRAM at 633 MHz

The Infineon (formerly Cypress) CY7C4141KV13-633FCXI is a 144 Mbit synchronous SRAM using QDR IV architecture, organized as 4M words by 36 bits. It clocks at 633 MHz on the parallel interface, delivering the high random-access throughput that network switches, 5G baseband line cards, and high-end test equipment demand.

At 633 MHz the QDR IV interface transfers data on both clock edges, so the effective data rate is 1.266 G transfers per second per pin. With a 36-bit data bus that is roughly 45.6 Gbit/s raw bandwidth. The tight 1.26 V to 1.34 V core supply is sized for the high-speed I/O — expect clean, low-inductance decoupling within 5 mm of each supply pin, and controlled-impedance PCB traces for the clock and strobe pairs. This is not a part you drop into a legacy layout; the board stack-up and signal integrity budget need to be designed around these edge rates from the start.

The 361-ball FCBGA (21x21 mm) is a fine-pitch BGA — no lab, no bench, let us go: you need a reflow oven with a profile matched to the solder ball alloy, and X-ray inspection to check for head-in-pillow or voids under the die shadow. This is not a field-swap part; if the board fails, the whole assembly comes back to the depot. The tray shipping medium is standard for large BGAs and keeps the balls undamaged before pick-and-place.

If dual-sourcing is critical, qualify the footprint for the full density range (72 Mbit to 288 Mbit) to keep options open.

Frequently asked questions

What is the memory organization of CY7C4141KV13-633FCXI?

Organized as 4M words by 36 bits (144 Mbit total). The x36 width suits designs that need a 36-bit data bus — common in networking ASIC interfaces or DSP memory banks.

Where can I buy CY7C4141KV13-633FCXI?

Contact us for current pricing and availability — we confirm both at quote time.