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Infineon Technologies CY7C4042KV13-106FCXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C4042KV13-106FCXC Infineon 72Mbit QDR-IV SRAM, 1.066 GHz

MPNCY7C4042KV13-106FCXC
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Infineon Technologies CY7C4042KV13-106FCXC, QDR-IV synchronous SRAM, 72Mbit, 2M x 36, 1.066 GHz clock, 1.26-1.34 V core, 0-70°C, 361-FCBGA tray.

$231.5125Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C4042KV13-106FCXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.26V ~ 1.34V
Frequency1.066 GHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR IV
Memory size72Mbit
Memory formatSRAM
Case361-BBGA, FCBGA
Memory organization2M x 36

Product details

72Mbit QDR-IV SRAM for high-throughput memory subsystems

The CY7C4042KV13-106FCXC is a 72Mbit Quad Data Rate IV synchronous SRAM organized as 2M x 36 bits, clocked at 1.066 GHz. This places it in the class of high-bandwidth memory used in network packet buffers, search engines, and compute accelerator local storage where the parallel QDR-IV bus delivers four data words per clock cycle on independent read and write ports.

1.066 GHz clock and the QDR-IV bus architecture

At 1.066 GHz, the QDR-IV interface transfers data at 2.133 Gbps per pin on the read and write ports simultaneously — the effective memory bandwidth is 4.266 Gbps per DQ pin. The parallel interface means the address and control buses run at the same clock rate, so the PCB trace-length matching across the full 36-bit data bus and the address/control group must hold within a few picoseconds of skew to close timing at the controller. The core supply tolerance is tight: 1.26 V to 1.34 V. A 1.3 V nominal rail with ±3% regulation is required — a standard 1.2 V or 1.5 V rail will not hold the core within spec.

361-FCBGA package — board integration and thermal management

The package is surface-mount only and requires a multi-layer PCB with a solid ground plane under the BGA footprint. The thermal pad at the centre of the package should be connected to an inner-layer copper pour for heat spreading — the 1.066 GHz core dissipates enough that a bare BGA without a thermal via array under the die shadow will exceed the 70°C ambient limit in a confined enclosure.

Frequently asked questions

What is the memory organization and interface of the CY7C4042KV13-106FCXC?

It is organized as 2M x 36 bits (72Mbit total) with a parallel QDR-IV interface. The QDR-IV architecture provides independent read and write ports, each transferring data on both clock edges at 1.066 GHz.