Obsolete — last-time-buy window closed
The CY7C2570KV18-500BZC: For sustainment programs that already carry this 165-FBGA footprint, the only sourcing channel is the independent surplus and broker market. Quantities are lot-specific and confirmed at RFQ; no factory lead time applies.
What the 500 MHz clock buys you
The 500 MHz clock rate on this DDR II+ SRAM means the memory delivers a peak data rate of 1 Giga-transfers per second per pin on the 36-bit-wide data bus — the double-data-rate architecture clocks data on both edges. For a networking ASIC or FPGA that needs a large, fast look-up table or packet buffer, this part keeps the pipeline fed without wait-state insertion. The 2M x 36 organization gives a 72 Mbit total depth with a 36-bit word width — a natural fit for 36-bit-wide datapaths common in telecom line cards and high-end test equipment. The parallel interface avoids the serialization latency of SPI or QSPI memories.
Package and supply rails for the board designer
The 165-FBGA (13x15 mm) footprint is a 1.0 mm ball-pitch array — no micro-vias required, but the 1.7–1.9 V core supply needs a dedicated rail with tight regulation. The 0–70 °C commercial temperature grade limits this part to indoor, controlled-environment equipment; it is not rated for extended industrial or automotive ambient ranges. Supplied in tray format — the 165-ball array is standard for this density class, and the footprint is shared with several other Cypress/Infineon DDR II+ SRAM densities, so a board layout designed for this part can often accept a different density variant from the same family without a respin.