450 MHz DDR II+ SRAM for high-throughput buffers
The CY7C2570KV18-450BZC: The 36-bit data word is a deliberate choice for networking gear and FPGA datapaths that need a wide memory bus without gluing multiple x18 or x9 parts. Housed in a 165-ball FBGA (13x15 mm), it mounts to the board via standard surface-mount reflow.
Cypress no longer manufactures it, and there is no direct pin-compatible drop-in successor listed in the official records. The only path to fill a BOM line is through surplus or broker inventory — new-old-stock or pulled material. That means date codes will vary, and counterfeit screening (visual inspection, X-ray, electrical test) is non-negotiable before the parts hit the pick-and-place.
165-ball FBGA — layout and rework notes
The PCB needs via-in-pad or microvia escape routing under the package.
It belongs in controlled environments — telecom central-office racks, lab instrumentation, test equipment — not in outdoor cabinets or engine bays. If the design expects an industrial or automotive temperature profile, this part will not hold up.