72 Mbit QDR II+ at 600 MHz — the buffer memory choice
The CY7C2565XV18-600BZXC is a 72 Mbit synchronous SRAM built on the QDR II+ architecture, organized as 2M x 36 bits. The 600 MHz clock rate delivers a peak data bandwidth of 2.4 Gbps per I/O pin when the read and write ports are fully utilized — this is the sort of throughput a high-end network switch or telecom line card needs for packet buffering and look-up tables. QDR II+ (Quad Data Rate) separates the read and write data buses, so the controller can issue a read and a write on the same clock edge without bus-turnaround dead cycles. For a 36-bit-wide data path running at 600 MHz, that means 2.4 GB/s of simultaneous read-write bandwidth — a tight fit for a 100 GbE forwarding engine or a deep FIFO in a radar signal processor.
Package and rework — 165-ball FBGA
The 165-ball FBGA (13 x 15 mm body) uses a 1.0 mm ball pitch — wide enough that a standard stencil and a reflow oven with a good thermal profile can handle it. The tray packaging is the factory-delivery format for this BGA. Tray-to-tape-and-reel conversion is possible at the distributor level, but the tray is the native medium — expect the parts to arrive in JEDEC trays unless you specify otherwise.
Supply rail and decoupling
Core supply is 1.7 V to 1.9 V — a 1.8 V nominal rail with ±0.1 V tolerance. The I/O supply is not listed separately in this record, but the QDR II+ standard typically runs a separate 1.5 V or 1.8 V VDDQ. Plan for a dedicated LDO or a low-noise buck converter per rail, and place the decoupling caps within 2 mm of the BGA balls — the 600 MHz edge rate will ring the supply plane if the bypass is too far. The parallel memory interface means 36 data pins plus address and control — a 165-ball BGA is just enough to route the full bus without pushing to a larger package. The 2M x 36 organization gives 72 Mbit of storage, which is 9 MB in byte-addressable terms — enough for a large CAM table or a deep packet buffer in a mid-range switch ASIC.
Active lifecycle — no obsolescence pressure
This part is safe for new designs and ongoing production. The base product number CY7C2565 covers a family of speed grades and temperature options; the -600BZXC suffix identifies the 600 MHz commercial-temp variant in the 165-FBGA package. If you need a backup supplier for the BOM, the QDR II+ standard is an open JEDEC specification, so other vendors (Renesas, GSI Technology) offer functionally equivalent parts — but the pinout and timing parameters must be verified against this specific Infineon device before committing the board.