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Infineon Technologies CY7C25652KV18-550BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C25652KV18-550BZXC Infineon 72Mbit QDR II+ SRAM, 550 MHz

MPNCY7C25652KV18-550BZXC
Active

Infineon Technologies CY7C25652KV18-550BZXC synchronous QDR II+ SRAM, 72Mbit, 2M x 36 organization, 550 MHz clock, 1.7V-1.9V supply, 165-FBGA (13x15), tray.

$307.6625Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C25652KV18-550BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency550 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

72Mbit QDR II+ SRAM at 550 MHz — the bandwidth ceiling

The CY7C25652KV18-550BZXC is a 72Mbit synchronous SRAM built on Infineon's QDR II+ architecture, organized as 2M x 36. The 550 MHz clock rate delivers a peak data bandwidth that suits high-throughput applications like network line cards, telecom switches, and high-end test equipment where the memory bus is the bottleneck, not the core logic. QDR II+ (Quad Data Rate) means the device transfers two words per clock cycle on both the read and write ports independently — effectively four data transactions per clock. At 550 MHz, the raw interface bandwidth exceeds 39.6 Gbit/s, which is why this part lands in systems where the memory subsystem must keep pace with high-speed serial links or packet-processing pipelines.

Package and board-fit for the layout engineer

Housed in a 165-ball LBGA (13x15 mm FBGA footprint), the 0.80 mm ball pitch demands a multi-layer PCB with controlled impedance on the address and data traces. The supply range is 1.7V to 1.9V — a clean 1.8V rail with <5% ripple is the target; the core and I/O share the same supply domain, so decoupling strategy is straightforward: one 100 nF per four VDDQ balls plus a bulk 10 µF on the board side. It is not rated for extended industrial or automotive thermal profiles; if the enclosure sees >70°C, a wider-temp variant is needed.

Active lifecycle — no design-in risk

Infineon lists the CY7C25652KV18-550BZXC as Active (current production).

Frequently asked questions

What is the memory organization of CY7C25652KV18-550BZXC?

It is organized as 2M words by 36 bits (2M x 36), yielding a total of 72 Mbit. The 36-bit word width is typical for systems that need a parity or ECC nibble alongside a 32-bit data bus.