72Mbit QDR II+ SRAM in a 165-ball BGA
The CY7C2563XV18-600BZXC is a 72Mbit synchronous SRAM organised as 4M x 18, built on the QDR II+ architecture — separate read and write ports each running at double data rate. The 600 MHz clock yields a peak bandwidth of 14.4 Gbps on the 18-bit data bus, making it a fit for high-throughput packet buffers and look-aside caches in network switches and routers. The commercial temperature range (0°C to 70°C) limits deployment to indoor, controlled-environment equipment.
Board integration and decoupling
The 165-FBGA footprint (13x15 mm, 1.0 mm ball pitch) routes out to four inner layers on a standard PCB — the supply balls are concentrated in the centre, so a 1.8V plane under the package is recommended to keep DC drop below 30 mV. Place 0.1 µF and 1 µF MLCCs within 3 mm of each VDD ball pair; the datasheet calls for a bulk 10 µF cap per four supply pairs on the back side of the board. The parallel memory interface (18-bit data, address, control) runs at 600 MHz DDR — trace length matching within ±50 ps between the SRAM and the controller is necessary to avoid setup/hold violations. Use controlled-impedance traces (50 Ω single-ended, 100 Ω differential for the clock pair) and avoid vias on the clock and strobe nets.
Active lifecycle and sourcing
No pin-compatible second source is documented in the Infineon portfolio.