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Infineon Technologies CY7C2563XV18-600BZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C2563XV18-600BZC QDR II+ SRAM, 72Mbit 600 MHz

MPNCY7C2563XV18-600BZC
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Infineon (Cypress) CY7C2563XV18-600BZC, 72Mbit Synchronous QDR II+ SRAM, 4M x 18 organization, 600 MHz clock frequency, 1.7V–1.9V supply, 165-FBGA (13x15), 0°C to 70°C, Tray.

$401.7500Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C2563XV18-600BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency600 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

72Mbit QDR II+ SRAM at 600 MHz — what the clock rate buys you

The CY7C2563XV18-600BZC is a 72Mbit synchronous SRAM from Infineon (formerly Cypress) using the QDR II+ architecture. It is organized as 4M x 18 and runs at a 600 MHz clock frequency, which gives the memory interface a peak data rate of 1.2 Gbps per I/O pin using double-data-rate transfers on both read and write ports. This part targets high-bandwidth, low-latency lookup and buffering in networking gear — switches, routers, and packet processors — as well as test equipment and compute-acceleration cards where the memory bus is the bottleneck. The 1.7V to 1.9V core supply keeps I/O levels in the 1.8V HSTL class, which is standard for this performance tier.

600 MHz — the so-what for timing closure

At 600 MHz the clock period is roughly 1.67 ns. The QDR II+ architecture uses separate read and write data buses, each clocked at the same frequency, so the controller must close timing on both ports simultaneously. This drives the need for tight PCB layout — controlled impedance, matched trace lengths, and minimal stub loading on the address/control lines. The 165-FBGA (13x15) package helps by keeping bond-wire inductance low, but the board designer still needs to budget for the on-chip termination and reference voltage (VREF) plane.

Package and supply — footprint and rail decisions

Surface-mount only. The supply range is 1.7V to 1.9V, so a 1.8V ±5% rail is the typical choice. The QDR II+ interface requires a separate VREF — usually 0.9V — generated from the 1.8V rail via a resistor divider or a dedicated reference buffer. The Tray shipping medium is standard for this BGA package; if your pick-and-place line prefers tape, the part is also available in Tape & Reel under a different order code (check the CY7C2563 family suffix).

There is no last-time-buy window open and no end-of-life notice issued. This is a current-production part, which means it remains eligible for authorized-distributor orders and is not limited to the surplus channel.

Frequently asked questions

Where can I buy CY7C2563XV18-600BZC?

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What is the current price and lead time for CY7C2563XV18-600BZC?

Cost and availability drive procurement decisions and BOM budgeting.

Is CY7C2563XV18-600BZC obsolete or end-of-life?

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What are the exact specifications and pinout of CY7C2563XV18-600BZC?

Design engineers need to validate fit in their circuit and ensure proper interfacing.

Does CY7C2563XV18-600BZC have a direct replacement or equivalent?

Sourcing and maintenance teams search for substitutes when stock is low or part is EOL.

What is the stock level of CY7C2563XV18-600BZC at major distributors?

Immediate availability affects production timelines and emergency repairs.