Skip to main content
Infineon Technologies CY7C2563KV18-500BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C2563KV18-500BZXI Infineon 72Mbit QDR II+ SRAM, 500 MHz

MPNCY7C2563KV18-500BZXI
Obsolete

Infineon Technologies CY7C2563KV18-500BZXI, QDR II+ synchronous SRAM, 72 Mbit, 4M x 18, 500 MHz clock, 1.7-1.9 V, -40 to 85°C, 165-ball FBGA (13x15 mm), tray.

$396.2900Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C2563KV18-500BZXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency500 MHz
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

72 Mbit QDR II+ SRAM at 500 MHz — the timing-critical buffer

The CY7C2563KV18-500BZXI is a 72 Mbit synchronous SRAM using Quad Data Rate II+ (QDR II+) architecture, organized as 4M x 18. The 500 MHz clock rate delivers back-to-back read and write operations on every rising and falling edge — effective data rate of 1 Gbps per I/O pin, making it a fit for high-bandwidth lookup tables, packet buffers, and cache in networking and telecom line cards. The parallel memory interface connects directly to a companion controller or FPGA with dedicated read and write ports — no bus-turnaround penalty between transactions.

Package and board-fit: 165-ball FBGA

The device is supplied in a 165-ball fine-pitch ball grid array (FBGA) measuring 13 x 15 mm (supplier device package 165-FBGA). The 1.0 mm ball pitch demands a multi-layer PCB with controlled impedance traces for the 500 MHz clock and data lines — a four-layer board is the practical minimum for signal integrity at these edge rates. The package is delivered in tray format, which is the standard carrier for BGA components in production programming and pick-and-place lines. The surface-mount footprint requires a solder reflow profile consistent with JEDEC J-STD-020 for moisture-sensitive devices.

Obsolete — last-time-buy window closed

Each lot is verified for authenticity and tested to the original datasheet limits before shipment. Availability is lot-specific and confirmed at RFQ — no blanket stock commitment can be made.

Frequently asked questions

What is the memory density and organization of CY7C2563KV18-500BZXI?

It is a 72 Mbit SRAM organized as 4M words x 18 bits. The 18-bit data width includes two parity bits per word when used in a 16-bit application, or can be treated as a full 18-bit word for wider data buses.

What package does CY7C2563KV18-500BZXI use?

A 165-ball fine-pitch ball grid array (FBGA) with a 13 x 15 mm body. The supplier device package code is 165-FBGA (13x15).