QDR II+ (Quad Data Rate) pipes read and write on separate ports, each transferring data on both clock edges, so the 333 MHz clock delivers a peak bandwidth of 2.4 GB/s per port. That throughput targets high-speed data-path buffers in network switches, routers, test equipment, and compute accelerators where a conventional SRAM bus would bottleneck.
165-ball FBGA — footprint and layout notes
The 165-ball FBGA (13 x 15 mm body) is a fine-pitch BGA that routes to a 4- or 6-layer PCB without blind vias if the escape pattern uses micro-vias on the top two layers. Place a 0.1 µF ceramic within 2 mm of each VDD/VDDQ ball pair; the datasheet's recommended 4.7 µF bulk cap per rail per quadrant prevents supply collapse during back-to-back 333 MHz bursts. The package is MSL 3 per the JEDEC standard; if the moisture barrier bag has been open longer than 168 hours at <30°C/60% RH, bake at 125°C for 48 hours before reflow.
Industrial temperature range — deployment scope
It is not characterized for extended-temp or military environments — the part has no radiation tolerance data, no MIL-STD-883 screening, and no QML certification. For avionics or downhole applications, a rad-hard or screened SRAM from the same QDR II+ family would be needed, but those are a different procurement path entirely.
Lifecycle status — obsolete, sourced through surplus
Any lot should be verified against the original datasheet for date code, marking, and functional test; counterfeit risk on obsolete high-speed SRAM is real, so a visual inspection and room-temperature functional check is a reasonable minimum before placing on a production board.