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Infineon Technologies CY7C25442KV18-333BZI — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C25442KV18-333BZI QDR II+ SRAM, 72Mbit, 333 MHz

MPNCY7C25442KV18-333BZI
Active

Cypress CY7C25442KV18-333BZI, QDR II+ synchronous SRAM, 72Mbit (2M x 36), 333 MHz clock, parallel interface, 1.7V-1.9V supply, -40 to 85°C, 165-FBGA (13x15 mm), Tray.

$245.2125Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C25442KV18-333BZI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency333 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

72 Mbit QDR II+ SRAM — what the 333 MHz clock buys you

It clocks at 333 MHz on a parallel interface, which means back-to-back read-write transactions with zero dead cycles — the bus never stalls between operations. That throughput matters for deep-packet buffers in network line cards, traffic managers, and telecom baseband processors where every clock cycle of access latency costs bandwidth.

Industrial temperature and the 165-FBGA footprint

Surface-mount only, and the Tray shipping medium tells you this is a production-quantity part, not a sample reel.

Active lifecycle — no end-of-life clock ticking

Infineon (formerly Cypress) lists this part as Active. For a memory device that often stays on a BOM for five to seven years, an Active status removes one sourcing headache. The base product number CY7C25442 covers the density and interface family, so if a speed or package variant is needed later, the roadmap stays within the same qualification envelope.

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Does CY7C25442KV18-333BZI have a direct replacement or equivalent?

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What is the package/case of CY7C25442KV18-333BZI?

Package type determines footprint compatibility in PCB layout and assembly.