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Infineon Technologies CY7C2245KV18-450BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C2245KV18-450BZXI QDR II+ SRAM, 36 Mbit, 450 MHz

MPNCY7C2245KV18-450BZXI
Active

Cypress CY7C2245KV18-450BZXI, 36 Mbit Synchronous QDR II+ SRAM, 450 MHz clock, 1.7 V – 1.9 V supply, 165-FBGA (13x15 mm), -40°C to +85°C.

$102.2800Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C2245KV18-450BZXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency450 MHz
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 36

Product details

36 Mbit QDR II+ SRAM at 450 MHz — what it buys you

The Cypress CY7C2245KV18-450BZXI is a 36 Mbit synchronous SRAM built on the QDR II+ architecture, organized as 1M x 36 and clocked at 450 MHz. QDR (Quad Data Rate) means the part transfers four data words per clock cycle — two reads and two writes — which effectively quadruples the data bandwidth compared to a single-data-rate SRAM at the same clock.

450 MHz clock — timing margin in the system budget

At 450 MHz the clock period is roughly 2.22 ns. The QDR II+ interface uses source-synchronous clocking with echo clocks from the SRAM, so the controller must account for flight time, clock skew, and setup/hold windows across the PCB. The 165-FBGA package (13x15 mm) keeps signal path inductance low, but the layout engineer will need controlled-impedance traces matched within a few picoseconds between the data and clock groups.

Industrial temperature range — where it runs

165-FBGA — rework and layout reality

The 165-ball FBGA on a 13x15 mm body is a fine-pitch BGA — expect ball diameters around 0.4 mm with a 0.8 mm pitch. This is reworkable with a good hot-air station and a stencil, but the board needs a via-in-pad or microvia fanout to route the 36 data lines plus address and control signals out of the inner balls.

Lifecycle status — active, no LTB pressure

The base product number CY7C2245 covers the whole density/speed family, so if a future spin needs a different speed grade or package, the pinout stays compatible across the series.

Frequently asked questions

What is the package for CY7C2245KV18-450BZXI?

It ships in a 165-ball FBGA (13x15 mm), supplied in a tray.

What is the memory technology of CY7C2245KV18-450BZXI?

It is a synchronous QDR II+ SRAM, volatile memory, organised as 1M x 36 bits, with a parallel interface.