The Cypress CY7C2170KV18-400BZXC is an 18Mbit synchronous SRAM using DDR II+ architecture, organized as 512K words by 36 bits. It clocks at 400 MHz.
At 400 MHz, the memory interface runs at 800 MT/s with DDR signaling. That clock rate demands careful PCB design: controlled impedance traces, matched lengths on the 36 data lines, and clean power delivery. If your system already runs a 1.8 V supply for the FPGA or ASIC, this part drops in without an extra regulator.
That means Cypress (now Infineon) has announced the final ordering window — once that window closes, no more factory shipments. For a production board that uses this exact density and speed grade, the procurement move is to secure lifetime buy quantities now or qualify a replacement. The BOM cost engineer should flag this as a single-source risk and plan the bridge.
The 165-ball FBGA (13x15 mm) is a fine-pitch BGA — not the easiest hand-rework target. If you are in a rework lab, expect to use a preheater and a profile that keeps the decoupling caps from reflowing off the back side.
This part is at home in a temperature-controlled server room, a lab instrument, or a telecom central office — not in an outdoor base station cabinet or an engine bay. If your system sees -40°C startup or 85°C inside the enclosure, this temperature grade will not hold.