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Infineon Technologies CY7C2165KV18-450BZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C2165KV18-450BZC SRAM - Synchronous, QDR II+, 450 MHz

MPNCY7C2165KV18-450BZC
Obsolete

Cypress CY7C2165KV18-450BZC, QDR II+ Synchronous SRAM, 18 Mbit (512K x 36), 450 MHz clock, 1.7V–1.9V supply, 165-FBGA, commercial temperature.

$43.4600Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C2165KV18-450BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency450 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II+
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

The 450 MHz clock rate delivers back-to-back read and write transactions without bus-turnaround dead cycles — the key advantage of a QDR (Quad Data Rate) design over a standard NoBL or DDR SRAM. This part is aimed at high-throughput buffer applications in networking line cards, test equipment, and signal-processing pipelines where sustained bandwidth matters more than latency. The 1.7 V to 1.9 V core supply and 165-ball FBGA package (13x15 mm) place it in the low-voltage, high-density memory tier for surface-mount assembly.

Commercial temperature — deployment scope

That confines this part to indoor, temperature-controlled equipment — office networking, lab instrumentation, or telecom central-office gear. Not a fit for outdoor base stations, motor drives, or engine-bay electronics where the ambient exceeds 70°C.

Frequently asked questions

What is the package for CY7C2165KV18-450BZC?

The part ships in a 165-ball FBGA (13x15 mm) on tray. The mounting is surface-mount.

What is the memory technology and density of this part?

It is a 18 Mbit synchronous SRAM using the QDR II+ architecture, organized as 512K x 36. The clock frequency is 450 MHz.