Skip to main content
Infineon Technologies CY7C1615KV18-250BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1615KV18-250BZXC 144Mbit QDR II SRAM, 250 MHz

MPNCY7C1615KV18-250BZXC
Active

Infineon/Cypress CY7C1615KV18-250BZXC, 144Mbit Synchronous QDR II SRAM, 4M x 36 organization, 250 MHz clock frequency, Parallel interface, 1.7V–1.9V supply, 165-LBGA, 0°C to 70°C.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1615KV18-250BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency250 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size144Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 36

Product details

144 Mbit QDR II SRAM for high-bandwidth data paths

The Infineon CY7C1615KV18-250BZXC is a 144 Mbit synchronous QDR II SRAM organized as 4M x 36 bits, clocked at 250 MHz. QDR II architecture provides independent read and write data ports on separate buses, eliminating the bus-turnaround dead cycles that plague conventional synchronous SRAMs.

At 250 MHz, the QDR II interface delivers a peak data rate of 18 Gbit/s on a 36-bit wide bus (double data rate on both read and write ports). This clock speed sets the timing budget for the FPGA or ASIC controller: PCB trace lengths must be matched within a few hundred mils, and the VTT termination resistors need to be placed close to the SRAM ball grid array. The 165-ball FBGA package (15 mm x 17 mm body) requires a multi-layer board with at least four signal layers to route the full 36-bit data bus plus address and control cleanly. If your existing design runs a slower QDR II part at 167 MHz or 200 MHz, this 250 MHz variant offers a direct speed-grade upgrade without changing the footprint — but the controller must support the faster clock.

For a high-density QDR II SRAM in active status, the supply channel is stable through authorized distribution. Independent distribution can support spot buys or bridge orders when factory lead times stretch, but the part is not in a phase-out cycle. No official second source or pin-compatible alternate is recorded in the Cypress/Infineon QDR II family — the footprint and timing are specific to this density and speed grade.

Provenance check for the 165-FBGA package

The 165-ball FBGA (15 mm x 17 mm) is a standard Infineon/Cypress QDR II footprint. Date-code and lot traceability should be verified against the manufacturer's factory marking format — the laser etch on the package top includes the base part number, a two-digit date code (year and work week), and a lot trace code. Any parts showing sanded or re-marked tops, inconsistent laser font, or missing date codes should be flagged for decap X-ray inspection before acceptance.

Frequently asked questions

Is CY7C1615KV18-250BZXC obsolete or end-of-life?

No, the CY7C1615KV18-250BZXC is listed as Active by the manufacturer.