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Infineon Technologies CY7C1612KV18-300BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1612KV18-300BZXC QDR II SRAM, 144Mbit, 300 MHz

MPNCY7C1612KV18-300BZXC
Obsolete

Infineon CY7C1612KV18-300BZXC, QDR II synchronous SRAM, 144Mbit (8M x 18), 300 MHz clock frequency, Parallel interface, 1.7V~1.9V supply, 165-FBGA, 0°C~70°C.

$247.7300Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1612KV18-300BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency300 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size144Mbit
Memory formatSRAM
Case165-LBGA
Memory organization8M x 18

Product details

QDR II stands for Quad Data Rate, second generation — it uses separate read and write ports, each operating at double data rate, so the memory controller can issue a read and a write in the same clock cycle without bus-turnaround dead cycles. The part is organised as 8 M words by 18 bits per word — the 18-bit width accommodates a 16-bit data payload plus two parity or tag bits, common in networking lookup tables and FIFO implementations. The parallel memory interface runs at a 300 MHz clock, delivering a peak bandwidth of 1.2 G transfers per second on each port (double data rate on both read and write clocks). This limits it to controlled indoor environments — server rooms, lab equipment, central-office telecom — not outdoor or under-hood automotive use.

Because there is no pin-compatible replacement listed, a redesign or qualification of an alternative QDR II SRAM from the same or a different vendor is the only long-term fix.

The 300 MHz clock frequency is the headline performance spec. On a QDR II device, the read and write clocks each run at 300 MHz, and data is strobed on both edges, so the I/O bus operates at an effective 600 MHz data rate. The memory controller must close timing on a 1.67 ns clock period — that means tight PCB trace-length matching, controlled impedance, and clean supply decoupling right at the 165-ball FBGA footprint. The 165-ball FBGA package (15 mm x 17 mm) requires careful PCB layout for signal integrity.

Frequently asked questions

Is CY7C1612KV18-300BZXC obsolete?

Yes, the CY7C1612KV18-300BZXC is listed as Obsolete by Infineon.

Does CY7C1612KV18-300BZXC come in a tray package?

Yes, the listed shipping medium is Tray. The device itself is housed in a 165-ball FBGA package (15 mm x 17 mm body).