Skip to main content
Infineon Technologies CY7C1612KV18-250BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1612KV18-250BZXI QDR II SRAM, 144 Mbit, 250 MHz

MPNCY7C1612KV18-250BZXI
Active

Cypress CY7C1612KV18-250BZXI, QDR II synchronous SRAM, 144 Mbit (8M x 18), 250 MHz clock, parallel interface, 1.7V–1.9V supply, -40°C to 85°C, 165-FBGA (15x17 mm), Tray.

$307.6800Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1612KV18-250BZXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency250 MHz
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size144Mbit
Memory formatSRAM
Case165-LBGA
Memory organization8M x 18

Product details

What this QDR II SRAM delivers at 250 MHz

Its 250 MHz clock rate supports back-to-back read and write transactions on separate data ports without dead cycles, which is the defining advantage of the QDR II family over conventional synchronous SRAM. The parallel memory interface keeps latency low for applications that cannot tolerate the protocol overhead of serial memory.

250 MHz clock — what it buys the system

At 250 MHz, the 18-bit-wide data bus operates at double data rate.

The base product number CY7C1612 covers the full QDR II density and speed range, so if a future speed-grade or package variant is needed, the same footprint and interface apply.

Design-in checklist for the 165-FBGA

The 165-ball FBGA (15x17 mm) requires a multi-layer PCB with at least four signal layers to route the 18-bit data buses cleanly. Supply decoupling should follow the manufacturer's recommendation for 1.8 V SRAM: a 0.1 µF capacitor per power ball pair, placed within 2 mm of the ball.

Frequently asked questions

How does CY7C1612KV18-250BZXI compare to CY7C1612KV18-200BZXI?

The 250BZXI runs at 250 MHz versus 200 MHz for the 200BZXI, providing 25% higher peak bandwidth. Both share the same 144 Mbit density, 8M x 18 organization, package, and temperature range. The speed upgrade tightens PCB timing margins but does not change the footprint.