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Infineon Technologies CY7C1563V18-375BZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1563V18-375BZC Cypress QDR II SRAM, 72 Mbit, 375 MHz

MPNCY7C1563V18-375BZC
Obsolete

Cypress QDR II synchronous SRAM, 72 Mbit (4M x 18), 375 MHz clock, parallel interface, 1.7V–1.9V supply, 165-FBGA, commercial temperature 0°C to 70°C, tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1563V18-375BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency375 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

72 Mbit QDR II at 375 MHz — what this SRAM was built for

The CY7C1563V18-375BZC: It clocks at 375 MHz on a parallel interface, which places it squarely in high-throughput networking gear — switches, routers, and line cards that need back-to-back read-write throughput without dead cycles between bus turns. The QDR II (Quad Data Rate) scheme delivers separate read and write ports, so the bus never stalls on turnaround; that matters when the packet buffer needs to sustain line-rate traffic through a lookup table or statistics counter bank. The supply rail runs at 1.7V to 1.9V, a core voltage that aligns with the sub-2V I/O standards common on ASICs and FPGAs from the same era. The 165-FBGA (15x17 mm) footprint requires a controlled-impedance layout on the address and data lines; the BGA pitch dictates micro-vias or blind vias in a multilayer board.

Obsolete — sourcing reality and the replacement question

There is no listed official successor in the available records. The 165-FBGA footprint and 375 MHz speed bin narrow the cross-ship options considerably; a direct drop-in replacement would need to match the 72 Mbit density, QDR II interface, and same package ball-out, which is a narrow search even in the QDR II family.

Package and mounting — FBGA handling notes

The device ships in a 165-ball FBGA (15x17 mm). The BGA pitch (likely 1.0 mm or 0.8 mm) requires X-ray inspection after reflow to catch hidden solder-joint opens or shorts under the package body. No moisture sensitivity level is stated in the available record, but a standard bake-out before reflow is prudent if the storage history is unknown.

Frequently asked questions

Is CY7C1563V18-375BZC obsolete?

Yes, Cypress (Infineon) has listed CY7C1563V18-375BZC as obsolete. No direct replacement is recorded. Sourcing is via surplus or broker channel.

What is the operating temperature of CY7C1563V18-375BZC?

This limits use to controlled indoor environments.