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Infineon Technologies CY7C1550KV18-450BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1550KV18-450BZXI 72Mbit SRAM, 450 MHz, Obsolete

MPNCY7C1550KV18-450BZXI
Obsolete

Infineon Technologies CY7C1550KV18-450BZXI, 72Mbit DDR II+ Synchronous SRAM, 450 MHz clock, 2M x 36 organization, 1.7V-1.9V supply, -40°C to 85°C, 165-FBGA.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1550KV18-450BZXI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency450 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II+
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

DDR II+ SRAM for high-throughput pipeline buffers

The CY7C1550KV18-450BZXI is a 72 Mbit synchronous SRAM built on DDR II+ (Double Data Rate II+) technology, clocked at 450 MHz. The 2M x 36 organization feeds wide datapaths — think network switch look-up tables, test equipment pattern buffers, or baseband processing where the bus width matches the word size. The 165-FBGA (13x15 mm) footprint is a standard high-density SRAM land pattern.

Infineon lists this part as Obsolete. The last-time-buy window has closed, so new inventory comes from independent surplus and broker channels — lot-specific, traceable to the original manufacturer, and confirmed at RFQ.

450 MHz clock rate and the read-write pipeline

The 450 MHz clock on a DDR II+ interface means data is transferred on both edges — effective data rate is 900 MT/s per pin. For a 36-bit-wide bus, that is 32.4 Gbit/s raw bandwidth into the SRAM array. The limiting factor in a real system is the controller's ability to sustain back-to-back read-write transitions without dead cycles. The 2M x 36 organization is a natural fit for 36-bit-wide datapaths (e.g., 32-bit data + 4-bit parity or ECC). A 72-bit wide bus would require two devices in parallel, matched on clock skew within the same FBGA footprint.

The 165-LBGA (13x15 mm) package is a standard JEDEC footprint for high-density synchronous SRAM. Surface-mount assembly with the listed Tray packaging is standard for volume reflow.