Obsolete high-bandwidth SRAM — sourcing through independent channels
The CY7C1545V18-375BZC: This SRAM uses a double-data-rate architecture (QDR II) that transfers data on both clock edges, delivering the throughput needed for high-performance networking buffers, telecom line cards, and test equipment where latency and bandwidth are critical.
Package and board integration — 165-FBGA footprint
The supplier device package is 165-FBGA (15x17); the board footprint must match the ball map from the datasheet. The core operates at commercial temperature (0°C to 70°C), so it is suited for indoor, temperature-controlled environments rather than industrial or automotive applications.
Sourcing reality — obsolete, quoted to order
No pin-compatible or functional successor is listed by Infineon. Any replacement would require a board-level redesign or qualification of an alternative QDR II SRAM from another vendor.