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Infineon Technologies CY7C1543V18-375BZC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1543V18-375BZC QDR II SRAM, 72Mbit, 375 MHz, 165-FBGA

MPNCY7C1543V18-375BZC
Obsolete

Infineon Technologies CY7C1543V18-375BZC QDR II SRAM, 72Mbit (4M x 18), 375 MHz clock, 1.7-1.9V, 0-70°C, 165-FBGA, Tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1543V18-375BZC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency375 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

QDR II SRAM at 375 MHz — the throughput ceiling

The CY7C1543V18-375BZC is a 72Mbit synchronous SRAM built on the QDR II architecture — a double-data-rate interface that reads and writes on both clock edges, effectively doubling the data throughput per pin compared to a single-data-rate SRAM at the same clock frequency. The 375 MHz clock translates to a 750 MT/s data rate on the I/O bus, which is the bandwidth gate for high-speed networking buffers, line-card packet memories, and test-equipment capture arrays. Organised as 4M x 18 bits, the part provides 18-bit-wide data paths — common in 18-bit parity or ECC-protected memory words — and operates from a 1.7 V to 1.9 V core supply, which keeps I/O swing low enough to reduce switching noise on a dense BGA board.

Package and board-fit — 165-ball FBGA

Housed in a 165-ball LBGA with a supplier device package of 165-FBGA measuring 15x17 mm, the part is a surface-mount BGA that requires a multi-layer PCB for fan-out. The 1.0 mm ball pitch is typical for this density class — a 4-layer board with blind vias can route the full 18-bit data bus and address lines without excessive layer count.

Obsolete — sourcing through surplus channels

The part is not supported for new designs; existing BOM lines must be filled through independent distribution or surplus inventory. For a line-down or repair situation, the part is available to quote against an RFQ — quantities are lot-specific and confirmed at quote time. No pin-compatible direct replacement from Infineon is documented, so a board spin or a parametric search for a QDR II SRAM in the same 165-FBGA footprint is the migration path for new builds.