Skip to main content
Log in
Infineon Technologies CY7C1518JV18-300BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1518JV18-300BZXC 72Mbit DDR II SRAM, 300 MHz, Obsolete

MPNCY7C1518JV18-300BZXC
Obsolete

Infineon Technologies CY7C1518JV18-300BZXC, synchronous DDR II SRAM, 72 Mbit, 300 MHz clock, 4M x 18 organization, 165-LBGA (15x17 mm), commercial 0 to 70 °C, Tray.

Infineon Technologies CY7C1518JV18-300BZXC datasheet (PDF)
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1518JV18-300BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency300 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

Memory parametric and lifecycle

The CY7C1518JV18-300BZXC is a 72 Mbit synchronous DDR II SRAM organized as 4M x 18, clocked at 300 MHz, and operates from a 1.7 V to 1.9 V supply. The parallel interface delivers high throughput for cache and buffer applications in networking or telecom line cards. Infineon lists this part as Obsolete.

Package and temperature grade

Housed in a 165-ball LBGA (15x17 mm body), the package footprint is standard for high-density SRAM of this generation. The commercial temperature range (0 °C to 70 °C) limits it to indoor, controlled-environment equipment — not suitable for extended industrial or automotive ambient.

Sourcing reality for an obsolete DDR II SRAM

With the official status set to Obsolete, the CY7C1518JV18-300BZXC is no longer manufactured. No franchised pipeline remains for new production.

Frequently asked questions

What is the listed package for CY7C1518JV18-300BZXC?

165-lead LBGA (15×17 mm body, supplier package 165-FBGA), supplied in Tray.

What technology does this part use?

SRAM — Synchronous, DDR II, with a parallel memory interface and a 300 MHz rated clock.