72 Mbit QDR II synchronous SRAM for high-throughput buffer applications
It clocks at 250 MHz and operates from a 1.7 V to 1.9 V supply. The part is housed in a 165-ball FBGA (13×15 mm) and rated for the industrial temperature range of –40°C to 85°C.
At 250 MHz, the 36-bit data bus transfers at double-data-rate on both read and write ports. The 2M x 36 organization requires 36 address bits per access.
The lifecycle record shows an EOL-hot flag alongside an Active status entry. This inconsistency means the part may be in a last-time-buy window or transitioning to end-of-life — the buyer should confirm the current factory order window and final shipment date before committing the BOM.
Package and mounting constraints
The 165-ball FBGA (13×15 mm) is a fine-pitch BGA requiring controlled solder-paste deposition and X-ray inspection after reflow. The surface-mount footprint is non-trivial for hand-assembly or rework — plan for a reflow oven and stencil.