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Infineon Technologies CY7C1514KV18-250BZXI — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1514KV18-250BZXI 72Mbit QDR II SRAM, 250 MHz

MPNCY7C1514KV18-250BZXI
Active

Infineon CY7C1514KV18-250BZXI, 72Mbit synchronous QDR II SRAM, 2M x 36 organization, 250 MHz clock, 1.7–1.9 V supply, 165-FBGA (13×15), –40 to 85°C.

$192.4600Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1514KV18-250BZXI Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency250 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

72 Mbit QDR II synchronous SRAM for high-throughput buffer applications

The Infineon CY7C1514KV18-250BZXI is a 72 Mbit synchronous SRAM built on the QDR II architecture, organized as 2M x 36 bits. It clocks at 250 MHz and operates from a 1.7 V to 1.9 V supply. The part is housed in a 165-ball FBGA (13×15 mm) and rated for the industrial temperature range of –40°C to 85°C. QDR II eliminates the bus-turnaround penalty between reads and writes, making this part a fit for network packet buffers, digital signal processing pipelines, and high-speed data acquisition systems where back-to-back throughput matters more than single-access latency.

250 MHz clock — what it means for the bus

At 250 MHz, the 36-bit data bus transfers at double-data-rate on both read and write ports. The 2M x 36 organization requires 36 address bits per access.

Lifecycle and sourcing reality

The lifecycle record shows an EOL-hot flag alongside an Active status entry. This inconsistency means the part may be in a last-time-buy window or transitioning to end-of-life — the buyer should confirm the current factory order window and final shipment date before committing the BOM. We source this part to order against an RFQ through independent distribution; availability and current pricing are confirmed at quote time. No official successor or pin-compatible second source is listed in the available records.

Package and mounting constraints

The 165-ball FBGA (13×15 mm) is a fine-pitch BGA requiring controlled solder-paste deposition and X-ray inspection after reflow. The surface-mount footprint is non-trivial for hand-assembly or rework — plan for a reflow oven and stencil. The industrial temperature rating (–40°C to 85°C) covers outdoor telecom cabinets and factory-floor equipment, but the BGA package itself imposes board-level reliability constraints under thermal cycling; a conformal coating or underfill may be needed in high-vibration or high-humidity environments.

Frequently asked questions

What is the CY7C1514KV18-250BZXI's package format?

The listed package is 165-LBGA / 165-FBGA (13×15 mm), supplied in tray format.