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Infineon Technologies CY7C1512KV18-333BZI — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1512KV18-333BZI QDR II SRAM, 72Mbit 333 MHz

MPNCY7C1512KV18-333BZI
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Infineon CY7C1512KV18-333BZI, 72Mbit synchronous QDR II SRAM, 333 MHz clock frequency, 4M x 18 organization, 1.7V–1.9V supply, 165-FBGA (13x15 mm), -40°C to 85°C industrial temperature range.

$190.9250Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1512KV18-333BZI Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency333 MHz
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Synchronous, QDR II
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization4M x 18

Product details

72 Mbit QDR II SRAM at 333 MHz — what it means for the line

The CY7C1512KV18-333BZI: 72 Mbit synchronous SRAM using QDR II architecture, organized as 4M x 18 bits. 333 MHz clock rate enables back-to-back read and write transactions on separate data ports.

EOL status — sourcing reality

333 MHz clock — timing margin in the bus

333 MHz clock frequency. QDR II architecture splits the data bus into separate read and write ports, eliminating turnaround penalty.

Frequently asked questions

What is the package and footprint for CY7C1512KV18-333BZI?

The package is a 165-ball FBGA (13x15 mm), surface mount. The supplier device package code is 165-FBGA (13x15).

What technology does CY7C1512KV18-333BZI use?

It is a synchronous QDR II SRAM — volatile memory with a parallel interface, organized 4M x 18 bits for a total of 72 Mbit.