It runs at a 200 MHz clock frequency, delivering back-to-back read and write operations on separate data ports without bus-turnaround dead cycles. The 1.7 V to 1.9 V core supply and 165-ball FBGA package (15x17 mm) target high-throughput networking, telecom line cards, and test equipment where a narrow, deep memory buffer is needed.
Obsolete — sourcing reality for the BOM line
The CY7C1512AV18-200BZC is officially obsolete per the manufacturer's lifecycle status. There is no listed direct successor from Infineon for this exact density and speed grade. If a production program needs a long-term supply, a QDR II+ or QDR IV part with a compatible interface and density should be evaluated for a board respin.
Package and footprint — 165-FBGA (15x17 mm)
The part comes in a 165-ball FBGA, 15x17 mm body. The shipping medium is tray, not tape-and-reel.