Synchronous SRAM for high-bandwidth data paths
The CY7C1480V33-167BZI: This makes it a fit for networking equipment, telecom line cards, and high-speed storage controllers where the processor needs a wide, fast scratchpad that keeps up with a backplane or switch fabric clock.
Obsolete — what that means for procurement
Each unit is sourced to order against an RFQ; traceability and date-code consistency are verified before shipment. The 165-FBGA package marking and tray packaging should match the original Infineon lot — any discrepancy in laser etch or carrier tape is a red flag on the gray market.
It is a surface-mount part supplied in trays. The fine-pitch BGA demands a controlled solder-paste stencil and a reflow profile matched to the 3.135–3.6 V supply rail — no special underfill is required for the industrial temperature range, but the board should have a moisture-sensitivity bake if the tray seal has been broken.