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Infineon Technologies CY7C1470V25-200BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1470V25-200BZC 72Mbit SRAM, 200 MHz, 3 ns

MPNCY7C1470V25-200BZC
Obsolete

Infineon Technologies NoBL™ SRAM, CY7C1470V25-200BZC, 72Mbit synchronous SDR, 200 MHz clock, 3 ns access, 2M x 36, 165-LBGA, tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1470V25-200BZC specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Voltage2.375V ~ 2.625V
Frequency200 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3 ns
Memory size72Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 36

Product details

72 Mbit NoBL SRAM at 200 MHz — timing closure and bus width

The CY7C1470V25-200BZC is a 72 Mbit synchronous SRAM from Infineon's NoBL (No Bus Latency) family, organized as 2M x 36. The 200 MHz clock rate and 3 ns access time set the window the memory controller must hit for zero-wait-state reads — at this speed, board trace length matching and Vtt termination on the data bus are not optional, they are closure requirements. The 36-bit word width maps directly to a 32-bit data bus plus parity or ECC lane without packing two cycles. The parallel interface expects a 2.5 V nominal core supply (2.375 V to 2.625 V), so the rail must stay within 100 mV of 2.5 V under load to avoid setup/hold violations at the I/O pins.

165-ball FBGA and the board-level constraints

Housed in a 165-ball LBGA with a 15x17 mm body (supplier device package 165-FBGA), the BGA footprint forces a minimum four-layer PCB — the inner layers carry the 2.5 V core plane and ground, while the outer layers route the 36-bit data bus plus address and control. The tray packaging means the parts arrive in matrix trays, not tape-and-reel — pick-and-place lines need a tray feeder or a manual transfer to tape for high-volume assembly.

For a BOM that already carries this order code, the procurement path is a spot-market buy against the remaining production or repair demand. There is no pin-compatible drop-in from the same manufacturer; a board redesign would be required to migrate to a current-generation synchronous SRAM.

Frequently asked questions

What is the memory organization and clock speed of this SRAM?

The CY7C1470V25-200BZC is a 72 Mbit synchronous SRAM organized as 2M x 36, with a 200 MHz clock frequency and a 3 ns access time.

What package does the CY7C1470V25-200BZC use?

It is supplied in a 165-ball LBGA (15x17 mm body), surface-mount, in tray packaging.