It clocks at 250 MHz, delivering two data words per clock edge on separate read and write ports — essentially a dual-port SRAM architecture without the dual-port cell penalty. This part is built for high-bandwidth, low-latency buffer memory in networking switches, routers, base stations, and test equipment where packet buffers or lookup tables need deterministic access at line rate.
At 250 MHz, the QDR II interface transfers data at 500 million transfers per second on each port (read and write simultaneously). That is a combined bandwidth of 9 Gbit/s per port (9-bit-wide data bus). The 4M x 9 organization means each access addresses 9 bits — typical for 9-bit-wide parity or ECC applications. The parallel memory interface requires careful PCB layout: matched trace lengths on the 9-bit data buses and the address/control lines, plus clean 1.8 V supply decoupling close to the BGA balls.
Last Buy — plan your final purchase now
The CY7C1426KV18-250BZC carries a Last Buy status. This means Cypress (now Infineon) has announced the end of production — the final order window is open, and once it closes, the part will no longer be manufactured. The 165-FBGA footprint is standard for this density, so a drop-in alternate from a different vendor may exist — but the buyer must verify timing, drive strength, and ODT settings against the original design.
Package and handling notes
The part ships in a tray (not tape-and-reel), which is typical for BGA devices in low-to-medium volume production. The 165-ball FBGA (13x15 mm) is a fine-pitch BGA — the ball pitch is 0.8 mm or 1.0 mm depending on the specific footprint variant. Surface-mount assembly requires a solder paste stencil, reflow oven, and X-ray inspection; hand-soldering is not practical.