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Infineon Technologies CY7C1423KV18-333BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1423KV18-333BZXC 36Mbit DDR II SRAM, 333 MHz

MPNCY7C1423KV18-333BZXC
End of Life

Cypress CY7C1423KV18-333BZXC, 36 Mbit synchronous DDR II SRAM, 333 MHz clock, 2M x 18 organization, Parallel interface, 1.7 V to 1.9 V supply, 165-FBGA (13x15) tray package, 0°C to 70°C operating temperature.

$44.6875Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1423KV18-333BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency333 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 18

Product details

The Cypress CY7C1423KV18-333BZXC is a 36 Mbit synchronous DDR II SRAM organised as 2M x 18, clocked at 333 MHz over a parallel interface.

For procurement teams managing a BOM freeze or a long-production-run contract, this active status means no urgent PCN watch or LTB trigger.

Frequently asked questions

What is the closest functional second-source for CY7C1423KV18-333BZXC?

The CY7C2262XV18-366BZXC is the closest functional peer — same 36 Mbit density, 2M x 18 organisation, and 1.7 V to 1.9 V supply, but clocked at 366 MHz instead of 333 MHz. Package and pinout differ; they are not drop-in replacements.

What is the package type for CY7C1423KV18-333BZXC?

The CY7C1423KV18-333BZXC is supplied in a 165-ball FBGA (13x15 mm) package, shipped in tray format.

Will CY7C1423KV18-333BZXC drop into a board designed for CY7C2262XV18-366BZXC?

No — the CY7C2262XV18-366BZXC uses a different package and pinout. A board designed for one will not accept the other without a PCB layout change.