CY7C1415KV18-300BZI 36Mbit QDR II SRAM, 300MHz, 1.8V, 165-LBGA
Infineon (Cypress) CY7C1415KV18-300BZI; 36Mbit synchronous QDR II SRAM, 300MHz clock, 1.7V–1.9V supply, 1M x 36 parallel organization, 165-LBGA (13x15mm) surface-mount package, -40°C to 85°C operating temperature, tray.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Memory type | Volatile |
| Mounting type | Surface Mount |
| Voltage | 1.7V ~ 1.9V |
| Frequency | 300 MHz |
| Memory interface | Parallel |
| Operating temperature | -40°C~85°C(TA) |
| Package | Tray |
| Technology | SRAM - Synchronous, QDR II |
| Memory size | 36Mbit |
| Memory format | SRAM |
| Case | 165-LBGA |
| Memory organization | 1M x 36 |
Frequently asked questions
Does the 1.7V–1.9V supply range fit a standard 1.8V rail?
Yes — the nominal 1.8V rail falls within the 1.7V–1.9V window. The ±100mV tolerance requires the board regulator to hold within that band across load conditions, which is achievable on a well-designed 1.8V LDO but should be verified on existing boards before a drop-in replacement is committed.
Is there a pin-compatible second source for this 36Mbit QDR II SRAM?
No second-source or cross-reference alternate appears in this ledger. The 1M x 36 organization and QDR II architecture narrow the field of true pin-compatible alternatives; qualification of any substitute falls to the engineering team and should be scoped before a last-time-buy is treated as a long-term supply strategy.
How should the 165-LBGA package be handled for board-level rework?
The 165-LBGA (13x15mm body) requires BGA rework process control — appropriate reflow profile for the ball metallurgy, X-ray inspection post-solder, and IPC Class 3 acceptance criteria. It is not a hand-solder part and any rework should follow the assembly site's BGA-specific workmanship standard.