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Infineon Technologies CY7C1412KV18-300BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1412KV18-300BZXC 36Mbit QDR-II SRAM, 300 MHz, 165-LBGA

MPNCY7C1412KV18-300BZXC
End of Life

Cypress CY7C1412KV18-300BZXC, a 36Mbit Synchronous QDR-II SRAM in 165-LBGA, 300 MHz clock, 1.7–1.9 V supply, 2M x 18 parallel organization, surface-mount, 0°C–70°C.

$42.9000Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

CY7C1412KV18-300BZXC Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency300 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageBulk
TechnologySRAM - Synchronous, QDR II
Memory size36Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 18

Frequently asked questions

Does this part's 1.7–1.9 V supply range match a standard 1.8 V rail on our existing line card?

Yes — the Cypress CY7C1412KV18-300BZXC operates at 1.7–1.9 V nominal, which brackets a standard 1.8 V rail. A peer DDR3 or DDR3L SRAM at 1.35–1.5 V or 1.5 V respectively does NOT share this rail without a rail redesign.

What derating margin does the 0°C–70°C operating window leave in a 55°C panel enclosure?

Roughly 15°C of margin above the 55°C internal ambient before datasheet derating applies — adequate for most rack installations, but the 165-LBGA thermal pad should be connected to the board ground plane; active cooling is application-dependent and driven by board-level thermal simulation, not a fixed requirement.