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Infineon Technologies CY7C1393KV18-300BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1393KV18-300BZXC 18Mbit DDR II SRAM, 300 MHz

MPNCY7C1393KV18-300BZXC
End of Life

Cypress CY7C1393 series, 18Mbit synchronous DDR II SRAM in 165-FBGA (13x15) tray; 300 MHz parallel interface, 1.7-1.9V supply, 1M x 18 organization, commercial 0°C to 70°C temp grade.

$37.3625Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1393KV18-300BZXC Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency300 MHz
Memory interfaceParallel
Operating temperature0°C~70°C(TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 18

Product details

What this DDR II SRAM is and where it fits

The CY7C1393KV18-300BZXC is a Cypress 18Mbit synchronous DDR II SRAM organized as 1M x 18 bits, clocked at 300 MHz over a parallel interface. It operates from a 1.7V to 1.9V supply and is housed in a 165-ball FBGA (13x15 mm) package. This part is designed for high-bandwidth, low-latency buffer applications in networking equipment, telecom line cards, and test instrumentation where the DDR II architecture eliminates dead cycles on back-to-back reads and writes.

300 MHz clock — what it means for the bus

At 300 MHz, the DDR II interface transfers data on both clock edges. The 1.7V to 1.9V core supply keeps I/O swing small.

Temperature grade and environment

Rated for 0°C to 70°C ambient, this is a commercial-grade part. It belongs in indoor, temperature-controlled racks — central-office telecom, data-center switches, or benchtop test gear. Not specified for industrial enclosures or outdoor cabinets where the ambient may swing outside that window.

Lifecycle and sourcing reality

This part carries an EOL hot lifecycle status, meaning the manufacturer has announced end-of-life and the last-time-buy window is open. Procurement should treat it as a time-limited sourcing event. We source and quote this part to order against an RFQ through independent distribution; availability and current pricing are confirmed at quote time. No official pin-compatible successor is listed in the available records, so any replacement would require a full qualification cycle.

Frequently asked questions

What package does CY7C1393KV18-300BZXC come in?

It ships in a 165-ball FBGA (13x15 mm) package, supplied in tray format.