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Infineon Technologies CY7C1393CV18-250BZXC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1393CV18-250BZXC 18Mbit DDR II SRAM, 250 MHz, Obsolete

MPNCY7C1393CV18-250BZXC
Obsolete

Cypress CY7C1393CV18-250BZXC, 18 Mbit synchronous DDR II SRAM, 1M×18 organization, 250 MHz clock, 1.7–1.9 V supply, 165-LBGA (13×15) surface-mount package, commercial 0–70 °C temperature grade, obsolete status.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1393CV18-250BZXC specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage1.7V ~ 1.9V
Frequency250 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 18

Product details

Any remaining stock in the channel is new-old-stock or surplus inventory. There is no factory lead time to rely on, so verify stock before committing the line.

250 MHz DDR II — what the clock rating means for throughput

This is a synchronous DDR II (Double Data Rate) SRAM, meaning data transfers on both rising and falling edges of the 250 MHz clock. The effective data rate is 500 MT/s per pin. The 1M×18 organization gives 18 data I/O lines, so the peak bandwidth is 9 Gbit/s (500 MT/s × 18 bits). That throughput class suits high-speed buffer applications — network packet buffers, test equipment capture memory, or DSP coefficient storage — where the bus must sustain back-to-back reads and writes without dead cycles. The DDR II architecture eliminates the bus-turnaround penalty that single-data-rate SRAMs incur when switching from read to write.

Package and reflow — 165-ball FBGA on a 13×15 mm body

The 165-FBGA (13×15 mm) is a fine-pitch BGA. The tray shipping medium means the parts arrive in matrix trays, not tape-and-reel, so your pick-and-place feeder setup needs a tray feeder or waffle-pack adapter. The 1.7–1.9 V supply rail is separate from the I/O voltage — confirm your PCB regulator can deliver 1.8 V nominal at the required current, and place decoupling capacitors close to each supply ball pair.

That rules out outdoor telecom cabinets, engine bays, or any environment that sees freezing or sustained heat above 70 °C. If your system lives in a climate-controlled room — server rack, lab instrument, office networking gear — the temperature range is adequate. For industrial or extended-temperature applications, you would need a different variant (the CV18 family includes industrial-grade options, but this specific order code is commercial).

Frequently asked questions

Is CY7C1393CV18-250BZXC obsolete?

Yes, the CY7C1393CV18-250BZXC is listed as obsolete. Cypress has ended production of this part. There is no recorded official replacement order code.

What is the difference between CY7C1393CV18-250BZXC and CY7C1393CV18-250BZXCT?

The difference is the shipping medium. The CY7C1393CV18-250BZXC ships in tray format, while the CY7C1393CV18-250BZXCT ships in tape-and-reel. The silicon, package, speed grade, and temperature range are identical. Choose based on your pick-and-place feeder requirements.

What are the specifications of CY7C1393CV18-250BZXC?

It is an 18 Mbit synchronous DDR II SRAM organized as 1M×18 bits. Clock frequency is 250 MHz (500 MT/s data rate). The interface is parallel. Package is a 165-ball FBGA (13×15 mm body). It is volatile memory.

Where can I buy CY7C1393CV18-250BZXC?

As an obsolete part, it is available through independent semiconductor distributors who carry new-old-stock or surplus inventory.