Skip to main content
Infineon Technologies CY7C1392CV18-200BZC — Memory (DRAM / SRAM / Flash / EEPROM)

Cypress CY7C1392CV18-200BZC 16Mbit DDR II SRAM, 200 MHz

MPNCY7C1392CV18-200BZC
Obsolete

Cypress CY7C1392CV18-200BZC, 16Mbit synchronous DDR II SRAM, 200 MHz clock, 1.7V–1.9V supply, 165-LBGA (13x15) surface-mount, 2M x 8 organization, 0°C to 70°C commercial grade.

$39.9400Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CY7C1392CV18-200BZC Technical Specifications
ParameterValue
Memory typeVolatile
Mounting typeSurface Mount
Voltage1.7V ~ 1.9V
Frequency200 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, DDR II
Memory size16Mbit
Memory formatSRAM
Case165-LBGA
Memory organization2M x 8

Product details

16 Mbit DDR II SRAM — 200 MHz, 1.8 V core, 165-ball BGA

The Cypress CY7C1392CV18-200BZC is a 16 Mbit synchronous DDR II SRAM organized as 2M x 8, clocked at 200 MHz, and operates from a 1.7 V to 1.9 V supply. It uses a parallel memory interface and comes in a 165-ball LBGA (13x15 mm) surface-mount package. This is a volatile, high-speed memory part intended for data buffering and cache applications in networking, telecom line cards, and DSP systems where DDR II burst throughput is needed.

200 MHz clock — timing budget for high-throughput designs

The 200 MHz clock rate defines the peak read/write bandwidth. For a 2M x 8 part, that translates to a 200 MT/s data rate on each I/O pin using DDR II double-data-rate signalling.

Commercial temperature grade — indoor deployment only

Rated for 0°C to 70°C ambient. That limits this SRAM to climate-controlled environments — telecom central offices, data centre line cards, lab instrumentation, or office equipment. Not suitable for outdoor base stations, engine bays, or factory floor enclosures without active cooling that keeps the board below 70°C.

Frequently asked questions

What is the memory organization of CY7C1392CV18-200BZC?

It is organized as 2M x 8 bits, giving 16 Mbit total density. The byte-wide data bus suits 8-bit or 16-bit DSP and FPGA interfaces.