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Infineon Technologies CY7C1382DV33-200BZI — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1382DV33-200BZI 18Mbit SRAM, 200 MHz, 3 ns, FBGA-165

MPNCY7C1382DV33-200BZI
Obsolete

Infineon Technologies CY7C1382DV33-200BZI synchronous SDR SRAM, 18Mbit, 1M x 18 organization, 200 MHz clock, 3 ns access time, 3.135V–3.6V supply, -40 to +85°C, 165-FBGA (13x15mm), tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1382DV33-200BZI specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage3.135V ~ 3.6V
Frequency200 MHz
Memory interfaceParallel
Operating temperature-40°C~85°C(TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3 ns
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization1M x 18

Product details

18 Mbit synchronous SDR SRAM — 200 MHz, 3 ns access

The CY7C1382DV33-200BZI is a 18 Mbit synchronous SDR (single data rate) SRAM organized as 1M x 18 bits, clocked at 200 MHz with a 3 ns access time from the clock edge. The parallel interface and pipelined architecture deliver deterministic read/write latency for cache, buffer, and FIFO applications in networking, telecom, and industrial controllers.

A board-level redesign to a current-generation synchronous SRAM or a pin-compatible alternative from another vendor should be evaluated for new production runs.

Package and board-fit: 165-ball FBGA, 13×15 mm

Housed in a 165-ball fine-pitch ball grid array (FBGA) measuring 13×15 mm, the package requires a multilayer PCB with microvia fan-out for the inner ball rows. The 0.80 mm ball pitch is compatible with standard HDI board processes. The tray packaging indicates the parts are shipped in matrix trays, not tape-and-reel — a factor for pick-and-place setup on high-volume lines.

Frequently asked questions

What is the closest pin-compatible alternative to CY7C1382DV33-200BZI?

No pin-compatible alternative is listed in the manufacturer's records. The part is a unique 1M x 18 synchronous SDR SRAM in a 165-FBGA package. A functional replacement would require a board spin to accommodate a different package or pinout.