Skip to main content
Infineon Technologies CY7C1370KV33-167AXI — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1370KV33-167AXI 18Mbit SRAM, 167 MHz, 3.4 ns

MPNCY7C1370KV33-167AXI
Active

Infineon Technologies NoBL™ Synchronous SRAM, 18Mbit (512K x 36), 167 MHz clock frequency, 3.4 ns access time, Parallel interface, 100-LQFP, Tray.

$32.7500Ref. price · indicative, final on quote
Packaging100-LQFP
RoHSROHS3 Compliant
SeriesNoBL™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY7C1370KV33-167AXI specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Voltage3.135V ~ 3.6V
Frequency167 MHz
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time3.4 ns
Memory size18Mbit
Memory formatSRAM
Case100-LQFP
Memory organization512K x 36

Product details

167 MHz synchronous pipeline with 3.4 ns access

The CY7C1370KV33-167AXI is a 18 Mbit NoBL™ synchronous SRAM organized as 512K x 36 bits, clocked at 167 MHz with a 3.4 ns access time from clock rising edge — the pipelined read operation delivers one data word per cycle once the initial latency is satisfied. It operates from a 3.135 V to 3.6 V supply rail and is rated over the industrial temperature range of -40°C to 85°C, which covers thermally demanding environments like outdoor telecom cabinets or factory-floor controllers without derating.

Package, supply rails, and routing checklist

Housed in a 100-lead LQFP (14x20 mm body, 0.5 mm pitch), the package routes to a 100-TQFP footprint per JEDEC MS-026 — the exposed pad on the backside must be soldered to a ground plane for thermal dissipation, and the 0.5 mm pitch demands a 4-layer PCB for clean fan-out of the address and data buses. The parallel memory interface requires all 36 data lines (DQ[35:0]) and 19 address lines (A[18:0]) to be length-matched within the clock period budget; the 3.135 V to 3.6 V supply rail should be decoupled with at least one 100 nF ceramic per supply pin pair plus a bulk 10 µF tantalum within 25 mm of the device.

Active lifecycle and supply posture

The device is ROHS3 compliant and sourced through authorized and independent distribution; availability and current pricing are confirmed at RFQ against the buyer's target quantity.

Frequently asked questions

What is the memory organization and interface of this SRAM?

It is organized as 512K x 36 bits with a parallel memory interface, clocked at 167 MHz with a 3.4 ns access time from the clock edge.

What temperature range and package does this part support?

Rated for industrial temperature from -40°C to 85°C, supplied in a 100-lead LQFP (14x20 mm body, 0.5 mm pitch) that maps to a 100-TQFP footprint.