Skip to main content
Infineon Technologies CY7C1370DV25-200BZCT — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon CY7C1370DV25-200BZCT 18Mbit SRAM, 200 MHz, 3 ns

MPNCY7C1370DV25-200BZCT
Obsolete

Infineon (Cypress) CY7C1370DV25-200BZCT, NoBL™ series, 18Mbit synchronous SRAM, 512K x 36 organization, 200 MHz clock, 3 ns access time, 2.375V–2.625V supply, 165-FBGA (13x15 mm), 0°C to 70°C.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1370DV25-200BZCT specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Voltage2.375V ~ 2.625V
Frequency200 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTape & Reel (TR)
TechnologySRAM - Synchronous, SDR
Access time3 ns
Memory size18Mbit
Memory formatSRAM
Case165-LBGA
Memory organization512K x 36

Product details

18 Mbit synchronous SRAM in a 165-ball BGA

It operates with a 200 MHz clock and delivers a 3 ns access time, running from a 2.375 V to 2.625 V supply.

The 200 MHz clock rate and 3 ns access time are the headline performance specs. At 200 MHz the memory can sustain back-to-back reads and writes without dead cycles, which is the whole point of the NoBL™ architecture — it eliminates the bus-turnaround penalty that standard synchronous SRAMs incur. The 3 ns access time means the first data word appears three clock edges after the address is presented, tight enough to keep a high-speed pipeline fed without wait states. If your system runs a bus clock near 200 MHz, this part fits without adding latency.

This part is listed as obsolete. That means Infineon no longer manufactures it, and the only available stock is what remains in the supply chain — new-old-stock, surplus, or broker inventory. If you have an active BOM line using this SRAM, you will need to source it through independent distribution.

165-ball FBGA — board-level considerations

The 165-ball FBGA (13 x 15 mm) is a fine-pitch BGA. Rework requires a hot-air station with a nozzle sized for the package, and the board must have a solder mask defined pad layout matching the Cypress footprint.

Frequently asked questions

Is CY7C1370DV25-200BZCT obsolete?

Yes, this part is listed as obsolete. Infineon no longer produces it. The only available units are from surplus or broker inventory.