Infineon Technologies CY7C1356C-250AXC — Memory (DRAM / SRAM / Flash / EEPROM)
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Infineon Technologies / Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1356C-250AXC Infineon NoBL SRAM, 9Mbit, 250 MHz

MPN CY7C1356C-250AXC
Active Spot Stock · 24-48h Dispatch 100% Original Sealed

Infineon Technologies NoBL™ synchronous SRAM, CY7C1356C-250AXC, 9Mbit (512K x 18), 250 MHz clock, 2.8 ns access time, 3.3V supply, 100-TQFP (14x20), tray.

In Stock: 1,072 pcs
MOQ: 1 pcs
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Unit Price (USD)
$14.05 / pc
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$14.05
10+ pcs
$12.65
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$11.52
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$10.40
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$9.69
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$9.13
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$14.05 / ea

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[SPEC] Essential Parameters Snapshot Full Specifications (14)
Package / Case 100-LQFP
Supply Voltage 3.135V ~ 3.6V
Speed / Frequency 250 MHz
Memory / RAM 9Mbit

Full Technical Specifications

14 Parameters
CY7C1356C-250AXC specifications
Parameter / AttributeSpecification / Value
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Supply voltage3.135V ~ 3.6V
Clock frequency250 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time2.8 ns
Memory size9Mbit
Memory formatSRAM
Case100-LQFP
Memory organization512K x 18
Series Sibling Variants

Infineon Technologies NoBL™ Series Models

Sibling variants, package options, and speed/density grades in this Infineon Technologies semiconductor series. Active Shenzhen warehouse allocation and rapid 24-48h dispatch.

Technical Details & Description

250 MHz synchronous SRAM for high-throughput data buffers

The CY7C1356C-250AXC is a 9Mbit synchronous SRAM from Infineon's NoBL™ family, organized 512K x 18 and clocked at 250 MHz. The 250 MHz clock rate sets the maximum bus throughput — at this speed the memory can sustain a new read or write on every clock edge in burst mode, making it suitable for high-bandwidth data buffers in networking or test equipment where the processor or FPGA needs deterministic access latency. The 2.8 ns access time is the delay from the clock edge to valid data on the output pins. In a system with a 250 MHz clock (4 ns period), the 2.8 ns access leaves 1.2 ns of setup margin for the receiving device — tight, but workable with controlled-impedance traces and matched propagation delays on the data bus.

Package, supply, and temperature grade — what fits the board

The part comes in a 100-lead LQFP with the supplier device package specified as 100-TQFP (14x20). The 0.5 mm pitch LQFP footprint is standard for this density — the 14x20 mm body fits a four-layer PCB with the address and data bus routed on inner layers. The supply voltage range is 3.135 V to 3.6 V, which is a standard 3.3 V rail with ±5 % tolerance; the core and I/O share this single supply, so no separate Vddq rail is needed.

Active lifecycle and compliance documentation

For compliance documentation, Infineon provides the standard ROHS3 declaration of conformity.

Frequently asked questions

Will the CY7C1356C-250AXC drop into a board designed for the CY7C1356C-166AXI?

Yes, the CY7C1356C-250AXC and the CY7C1356C-166AXI share the same base product number (CY7C1356) and the same 100-TQFP (14x20) package footprint. The pinout is identical — the only differences are the clock speed (250 MHz vs 166 MHz) and the temperature grade (commercial 0°C to 70°C vs industrial -40°C to 85°C). A board designed for the -166AXI will accept the -250AXC without PCB changes, but the system must be able to run at the higher clock rate.

What is the memory organization of the CY7C1356C-250AXC?

The memory is organized as 512K words by 18 bits, giving a total of 9 Mbit. The 18-bit word width means 16 bits are used for data and 2 bits for parity or additional control in systems that need it — the extra two bits per word are available as byte-lane selects or error-detection bits without wasting a second device.

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