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Infineon Technologies CY7C1355C-100BGC — Memory (DRAM / SRAM / Flash / EEPROM)

CY7C1355C-100BGC 9Mbit NoBL SRAM, 100 MHz, 119-BGA

MPNCY7C1355C-100BGC
Obsolete

Infineon Technologies NoBL™ SRAM, Synchronous SDR, 9Mbit, 256K x 36, 100 MHz, 7.5 ns, 3.135V-3.6V, 0°C-70°C, 119-PBGA, Tray.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

CY7C1355C-100BGC specifications
ParameterValue
SeriesNoBL™
Memory typeVolatile
MountingSurface Mount
Voltage3.135V ~ 3.6V
Frequency100 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageTray
TechnologySRAM - Synchronous, SDR
Access time7.5 ns
Memory size9Mbit
Memory formatSRAM
Case119-BGA
Memory organization256K x 36

Product details

Obsolete — last-time-buy window closed

Infineon Technologies has marked the CY7C1355C-100BGC as Obsolete. This means the manufacturer has discontinued production and no last-time-buy window remains open. Sourcing now runs through independent distribution channels — quantities are lot-specific and confirmed at RFQ.

256K x 36 at 100 MHz — the pipeline decision

This is a 9 Mbit synchronous SRAM organized as 256K words by 36 bits. The 100 MHz clock frequency and 7.5 ns access time set the read/write throughput ceiling — the pipeline depth and output hold time relative to the next clock edge determine whether this part meets the bus timing in a given controller interface. The 36-bit word width suits systems that need parity or ECC bits alongside a 32-bit data path without an extra chip.

NoBL architecture — why it matters for back-to-back transactions

The NoBL (No Bus Latency) series eliminates the dead cycle between read and write operations that conventional synchronous SRAMs require. In a cache-line fill followed by a write-back, the controller can issue a write on the clock edge immediately after the read address — no idle cycle needed. This matters most in systems where memory bandwidth is the bottleneck, such as network packet buffers or DSP scratchpads.

119-ball PBGA — footprint and rework considerations

Housed in a 119-ball plastic BGA with a 14x22 mm body. The 1.27 mm ball pitch is standard for this density — four-layer board fan-out is straightforward, and the package is reworkable with a typical hot-air profile.

Supply rails and interface

The parallel memory interface uses standard LVTTL I/O levels; no external level translation is needed when the controller also runs at 3.3 V.