DDR II SRAM for high-bandwidth buffering
The Cypress CY7C1320KV18-333BZXC is an 18Mbit synchronous DDR II SRAM organized as 512K x 36 bits, clocked at 333 MHz over a parallel interface. It operates from a 1.7V to 1.9V supply and comes in a 165-ball FBGA package measuring 13x15 mm. This is a volatile memory part designed for high-throughput applications where low-latency random access and sustained bandwidth matter — think network packet buffers, switch look-aside tables, or high-end test equipment.
333 MHz clock — what it buys the system
At 333 MHz, this DDR II SRAM delivers double-data-rate transfers on each clock edge, effectively doubling the throughput versus a single-data-rate part at the same frequency. For a 36-bit-wide bus, that works out to over 2.4 GB/s of peak bandwidth. The trade-off is tighter timing closure on the PCB — the 333 MHz clock and parallel bus need controlled impedance, matched trace lengths, and clean supply decoupling right at the BGA balls. The 1.7V to 1.9V core supply also means a dedicated regulator rail, not a shared 3.3V or 2.5V plane.
The 165-ball FBGA (13x15 mm) uses a standard lead-free solder ball composition. The 13x15 mm body and 1.0 mm ball pitch need a solder paste stencil with 0.45 mm aperture diameter and a reflow profile peaking at 245°C to 260°C. Place a 4.7 µF ceramic cap per supply ball cluster within 2 mm of the BGA footprint; the via-in-pad technique with filled and capped vias keeps the solder joints flat.
Temperature grade and deployment scope
It is not qualified for industrial or automotive use where ambient temperatures exceed 70°C or fall below freezing.
For new designs, it is a safe choice with normal lead times through distribution.